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Brewer Science, EV Group Announce Agreement on ZoneBOND Technology

Enabling commercialization of groundbreaking temporary bonding and debonding technology

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By: DAVID SAVASTANO

Contributing Editor, Coatings World and Ink World, Coatings World and Ink World Magazine

Brewer Science, Inc. and EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced an agreement on ZoneBOND technology. The agreement will enable both companies to commercialize the groundbreaking technology for customers in the temporary wafer bonding market.

The ZoneBOND technology provides a breakthrough approach for temporary wafer bonding, thin wafer processing and debonding applications which overcomes the last remaining limitations associated with thin wafer processing. ZoneBOND technology allows the use of silicon, glass, and other carriers, is compatible with existing, field-proven adhesive platforms, and enables debonding at room temperature with virtually no vertical force being applied to the device wafer.

“We are delighted to be able to bring the exciting ZoneBOND temporary bonding and debonding technology to the market,” said Dr. Terry Brewer, founder, CEO and president of Brewer Science. Paul Lindner, executive technology director of EV Group, added, “Combining Brewer Science’s advanced material development and process integration and EVG’s field-proven equipment and process solutions, ZoneBOND will enable customers to achieve a quantum leap in thin wafer processing.”

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